Durable substrate subassembly for transistor switch module

摘要

A durable substrate subassembly for a high power transistor switching module. The substrate subassembly is durable because wire bonds to the semiconductor device electrodes are replaced with a soldered metal/ceramic composite conductor. The part of the composite conductor contacting the semiconductor device has a coefficient of thermal expansion close to that of the semiconductor device. The metal of the composite conductor is preferably a strip of copper foil. The ceramic portion is a layer of alumina on the copper foil that is generally coextensive with the semiconductor device electrodes.