发明名称 |
Integrated pull tester with an ultrasonic wire bonder |
摘要 |
An ultrasonic wire bonder including apparatus for testing a bond includes a bonding tool ultrasonically driven for welding a wire on an underlying substrate and a clamp for holding the wire to be bonded by the bonding tool. The same clamp or other pulling apparatus moves the wire that has been bonded with a pre-established force to determine whether the bond will withstand the force. The accompanying method for testing a bond includes holding the wire after the bond has been made with the same holder and pulling the wire with a pre-established force substantially along the direction of the wire's longitudinal axis to determine the strength of the bond.
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申请公布号 |
US5894981(A) |
申请公布日期 |
1999.04.20 |
申请号 |
US19960757877 |
申请日期 |
1996.11.27 |
申请人 |
ORTHODYNE ELECTRONICS CORPORATION |
发明人 |
KELLY, GREGG S. |
分类号 |
B23K20/00;B23K20/10;B23K31/12;G01N3/00;H01R43/02;(IPC1-7):H01L21/60 |
主分类号 |
B23K20/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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