发明名称 |
Integrated circuit with a chip on dot and a heat sink |
摘要 |
Disclosed is a flexible substrate having a thermal contact that provides a continuous high thermal conductivity path from a heat generating component to a heat sink. In one embodiment, the thermal contact includes a metallic trace including a raised feature of thermally conductive material. A solder ball or fillet may be used to make a connection between the raised feature and the heat generating component or between the raised feature and the underlying heat sink or both.
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申请公布号 |
US5896271(A) |
申请公布日期 |
1999.04.20 |
申请号 |
US19970897584 |
申请日期 |
1997.07.21 |
申请人 |
PACKARD HUGHES INTERCONNECT COMPANY |
发明人 |
JENSEN, ERIC DEAN;CRUMLY, WILLIAM R.;FEIGENBAUM, HAIM;SCHREIBER, CHRIS M. |
分类号 |
H01L23/367;H01L23/498;H05K1/02;H05K1/05;H05K1/11;H05K1/18;H05K3/20;H05K3/40;H05K7/20;(IPC1-7):H05K7/20 |
主分类号 |
H01L23/367 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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