| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a substrate splitting method using a carbon dioxide laser beam capable of surely splitting a substrate along a splitting guide groove precisely by particleless and dry processes. SOLUTION: When the substrate is split by irradiating the surface of the substrate 1 with the carbon dioxide laser beam, the splitting guide groove 5 for a splitting line is previously formed by a chemical etching technique, and the substrate l is split by irradiating the groove with the laser beam. The width and depth of the groove 5 is controlled with high precision because of forming by the chemical etching technique, consequently a cutting allowance width S for splitting is narrowly restrained and also a side surface of the groove is controlled to a uniform surface. Therefore, splitting is faithfully executed with high dimensional precision along the splitting groove and a side surface of the substrate after splitting is also kept uniform.</p> |
