Semiconductor device with electrical connection between semiconductor chip and substrate less breakable during shrinkage of adhesive compound

摘要

An adhesive compound layer bonds the reverse surface of a semiconductor chip to a major surface of a substrate, and a restoring compound layer is formed on a top surface of the semiconductor chip; the adhesive compound layer and the restoring compound layer exert a first force on the reverse surface and a second force on the top surface due to shrinkage during a thermosetting so that a first moment due to the first force is reduced or canceled by a second moment due to the second force, thereby preventing the semiconductor chip from undesirable warp.