| 摘要 |
<p>PROBLEM TO BE SOLVED: To obtain an LED print head in which thermal resistance of the entire system is decreased and temperature rise of an LED chip or a driver IC chip can be suppressed. SOLUTION: The LED print head comprises a surface first conductor 9 formed on the surface of a multilayer printed wiring board 7, an inner layer conductor 10 formed on a layer in the multilayer printed wiring board 7 connected electrically with the surface first conductor 9 through a plurality of first through holes 11 in the multilayer printed wiring board 7 for a driver IC chip 3, a surface second conductor 12 formed on the surface of the multilayer printed wiring board 7 connected electrically with the inner layer conductor 10 through a plurality of second through holes 13 in the multilayer printed wiring board 7 for the driver IC chip 3, a first protrusion 19 of metal being secured to the housing while touching the surface first conductor 9, an insulation film 20 sandwiched by the driver IC chip 3 and the first protrusion 19, and a second protrusion 21 of metal being connected with a heat sink while penetrating the housing and touching the surface second conductor 12.</p> |
