| 摘要 |
PROBLEM TO BE SOLVED: To obtain a resin paste, capable of readily uniformizing the film thickness, good in releasibility from a plate and excellent in resolution and to provide an electronic part and a semiconductor device excellent in heat resistance and reliability by using the resin paste for forming a film. SOLUTION: This resin paste has >=0.2 and <=1.5 tanδwhich is the ratio of the loss elastic modulus to the storage elastic modulus measured at 1 rad/s frequency. The method for forming a film comprises carrying out the screen printing of the resin paste by using a mesh plate having <=25μm wire diameter and >=250 mesh and a squeegee, made of a rubber and having >=70 and 90 deg. rubber hardness. Furthermore, the method comprises performing the screen printing of the resin paste by using a meshless metallic plate and a squeegee, made of a resin and having >=90 deg. rubber hardness or a squeegee made of a metal. The electronic part is obtained by forming a film on a wiring substrate or a flexible tapelike substrate according to a method for forming the film and the drying the formed film. Furthermore, the semiconductor device is produced by forming a film on a semiconductor, a lead frame or a die pad according to the method for forming the film and drying the formed film. |
