Process for encapsulating an electronic component

摘要

Process for encapsulating an electronic component, in particular an integrated circuit, with an encapsulating material, at least comprising the steps of: placing the component to be encapsulated in a cavity of a mold; introducing the encapsulating material at elevated temperature into the cavity between the mold and the component to be encapsulated; hardening the encapsulating material; and releasing the encapsulated component from the cavity, the encapsulating material used comprising 40-65% by weight of the engineering thermoplast and 60-35% by weight of the reactive solvent.