| 摘要 |
PROBLEM TO BE SOLVED: To obtain the subject composition, rapidly curable at a relatively low temperature and strongly bondable to a metal, a glass and a plastic material without using a primer and useful as a coating agent for electrical and electronic parts by including a specific organosilicon compound or the like therein. SOLUTION: This composition is obtained by including (A) 100 pts.wt. polyorganosiloxane containing an alkenyl group such as vinyl group bound to silicon atom in the molecule, (B) 0.5-100 pts.wt. organosilicon compound having at least three hydrogen atoms bound to silicon atom in the molecule and at least one group represented by the formula (Q1 and Q2 are each an alkylene; R is a 1-4C alkyl) and further a siloxane skeleton having >=20 number of silicon atoms and (C) a platinum-based, palladium or a rhodium-based compound (e.g. chloroplatinic acid) in an amount of preferably 0.5-200 ppm expressed in terms of the element. |
