| 摘要 |
PROBLEM TO BE SOLVED: To enable a device to perform super-high accurate mirror work and flatting work, by applying dressing to a polishing cloth during polishing work of a workpiece, and holding the polishing cloth always under the condition of best dressing. SOLUTION: A chuck mechanism 1 is lowered down by a lift means, a workpiece W mounted in a lower surface of a chuck main unit 1a is brought into contact with an upper surface of a polishing plate 3a of a polishing mechanism 3, by respective rotation, polishing work is applied to a polishing surface of the workpiece W. During polishing work, a dressing mechanism 2 is lowered down by a lift means, a dressing surface of a polishing dresser 1 is brought into contact with an upper surface of the polishing plate 3a of the polishing mechanism 3, by respective rotation, dressing is applied to a work surface of the polishing cloth 3a. |
