SEMICONDUCTOR CHIP WITH SMALLER BONDING WINDOW THAN WIRE BALL AND ITS MANUFACTURING METHOD

摘要

A semiconductor chip is provided comprising a semiconductor substrate having determined circuit elements on it, a surface-smoothing layer deposited on the substrate, a bonding pad formed on the smoothing layer and connected electrically to the circuit elements, a passivation layer formed on the surface-smoothing layer, the passivation layer having a window for exposing a part of the bonding pad, and a second metal layer having a same height as the passivation layer and occupying peripheral parts of the window to form a reduced bonding windows for the bonding pad.