Verfahren zur Herstellung einer elektronischen Leistungsschaltung und nach diesem Verfahren erhaltene elektronische Schaltung
摘要
<p>The circuit includes a pcb (6) with ICs (7) and connection pads (8). Current bars (9) are fixed with their extremities to the pads using screws (10). The pcb has a structure which includes a copper layer deposited on a heat removing layer of aluminium covered by a plastic coating. Electronic components (11) are then placed on the pcb by a machine. All the component terminals and the connections pads are then soldered to the pcb conducting paths. Components which cannot be soldered are subsequently mounted on the pcb. <IMAGE></p>