| 摘要 |
The wafer drying apparatus disclosed includes a plurality of cradles, a turntable, a drying chamber, a balancing mechanism, a shielding plate, and an isolating chamber. The shielding plate is formed of half circular plates which are provided respectively to the supporting member, are partially overlapped near the axis of horizontal rotation, and are configured such that the balancing mechanism is covered thereby and that a peripheral portion thereof extends to a side wall of the drying chamber and is provided with a plurality of vanes. The isolating chamber is partitioned by the shielding plate and has a partition plate defining a vacant section surrounding the balancing mechanism and an exhaust opening from which the air in the drying chamber is drawn out by a pumping action of the vanes due to the rotation of the shielding plate and is exhausted to the outside through an external wall of the partition wall. In this way the balancing mechanism which is a moving member is not exposed to the drying chamber and the contaminants from the balancing mechanism are prevented from entering into the drying chamber. |
