| 摘要 |
An apparatus for crimping terminals on an electrical conductor including a novel mechanism for adjusting the crimp or shut height. An anvil is secured to a supporting structure and a ram is mounted for reciprocating movement on the supporting structure in a direction toward and away from the anvil. The anvil and the ram carry cooperating die members which act to crimp the terminal on a conductor which is positioned between the anvil and the ram. The ram is moved in reciprocating movement by a toggle mechanism which interconnects the ram and the supporting structure, and the toggle mechanism is movable between an under-center open position, an on-center crimping position and an over-center open position. The location of the pivotal connection of the toggle mechanism to the supporting structure can be adjusted to selectively vary the spacing between the die members when the toggle mechanism is in the on-center position to thereby adjust the crimp height. |
