发明名称 FLOORING MATERIAL FOR WIRING
摘要 <p>A flooring material is composed by interpositioning at least one intermediate layer (2), in the form of a sheet that is weakly adhered to a sheet base material (1) to an extent that at least its upper surface can be easily peeled from said sheet base material (1), within said sheet base material corresponding to the bottoms of wiring grooves (6 and 7) formed in said sheet base material (1). A plurality of cuts are made along cut lines (4 and 5) of said flooring material at a depth that extends to the above-mentioned intermediate layer (2) at prescribed intervals. Wiring grooves (6 and 7) are formed by peeling off portions (1a and 1b) of the sheet base material (1) within said cut lines to enable wiring along said grooves (6 and 7).</p>
申请公布号 KR0166606(B1) 申请公布日期 1999.04.15
申请号 KR19940033037 申请日期 1994.12.07
申请人 MITSUBISHI BURLINGTON CO.,LTD;ISHIWATARI, HIROHIKO 发明人 SATO, MINORU;NAKASHIMA, ISAO;ABE, KENJI;MAEYAMA, HIDEO;ISHIWATARI, HIROHIKO
分类号 E04F15/18;H02G1/00;H02G3/00;(IPC1-7):H02G1/00 主分类号 E04F15/18
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