SEMICONDUCTOR DEVICE

摘要

A semiconductor device comprising a semiconductor element (1), a carrier member (2) for the semiconductor element, electrical connection conductors (3) and wire connections (4) between connection areas (7) on the semiconductor element and the electrical connection sconductors is provided with a coating (6, 9) on the surface of the semiconductor element remote from the carrier member, where the active circuit is situated, and is enveloped with a synthetic material, which coating (6, 9) is electrically insulating and has an elasticity for absorbing shear stresses which occur between the active surface (5) of the semiconductor element and the envelope. To prevent pattern shift as well as wire fracture or tearing off of the wire, the coating (9) is present at the outer edge of the active surface of the semiconductor element (1), leaving exposed the central portion of this surface, the coating (9) extending beyond the connection areas (7) for the wire connections.