发明名称 HEAT SHEILD WITH MOLDABLE INSULATION
摘要 A temperature monitoring assembly adapted to be positioned adjacent a structure in order to make temperature measurements at the surface of the structure is pro vided. The assembly includes a thermocouple means, a pad adapted for weldable attachmen t to the surface of the structure and having a slot therein for securing an end of th e thermocouple means adjacent the surface of the structure at a desired location, and a heat shield forming a partially enclosed volume and having an opening shaped to confo rm to the surface of the structure so as to protect the thermocouple means from radiat ed heat when the shield is placed upon and welded to the structure over the thermocouple means. A portion of the thermocouple means extends though a slot in the heat shield to communicate measured temperature data. Insulating material is positioned within the partially enclosed volume of the heat shield for thermally isolating the thermoc ouple means so that the thermocouple means is substantially exposed only to heat trans ferred from the structure. The insulating material is moldable to the shape of the pad and the thermocouple means and hardens to a semi-rigid form, whereby premolding of the insulating material within the heat shield ensures that the heat shield will be properly placed over the pad and the thermocouple means for accurate temperature measurem ent of the structure.
申请公布号 CA2250454(A1) 申请公布日期 1999.04.15
申请号 CA19982250454 申请日期 1998.10.14
申请人 GAY ENGINEERING & SALES COMPANY, INC. 发明人 CRUMP, LARRY W.;DUTCHER, DALE E.
分类号 G01K1/14;G01K7/10;(IPC1-7):G01K7/10 主分类号 G01K1/14
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