WIRING BOARD CONSTRUCTIONS AND METHODS OF MAKING SAME

摘要

A wiring board construction (10) includes at least one microvia (12) disposed in a base substrate (14) and includes a deep imprinted cup shaped in the top surface thereof (24). A conductor material is disposed within the recess (26), and has a portion disposed at the bottom thereof. A conductor disposed at a bottom surface of the substrate opposite to the conductor material bottom portion (31) helps to complete an electrically conductive path through the substrate.