| 摘要 |
Ball bonding method, such as a gold wire bonding method, comprising the following process steps: positioning and lowering of a bonding capillary (10) with a scarfed bonding wire ball (12) at the lower, free end of a bonding wire (11) from a raised initial position onto a first bonding site (17); welding of the ball (12) with the input of heat, a defined application force and/or ultrasonic assistance; raising the bonding capillary (10); formation of a bonding wire loop (21); welding the bonding wire (11) at a second bonding site (16) with the input of heat, a defined application force and/or ultrasonic assistance; raising the bonding capillary (10) into a predefined tail-length position (28), breaking the bonding wire (11) by exerting a tensile force thereon by means of a wire staple (13) acting on the bonding wire (11) and subsequent raising of the bonding capillary (10) into the initial position; and scarfing of the free bonding wire end with the formation of a new ball (12). For the purpose of a defined coordination of a scarfing lance (18) provided as a device for scarfing the free bonding wire end in relation to said bonding wire end, the free wire tip, after the breaking of the bonding wire (11), is set exactly with respect to the distance to the scarfing lance (18). <IMAGE> |
