发明名称 MANIFOLD INCORPORATING A THERMOELECTRIC MODULE AND A COOLING DEVICE USING THE THERMOELECTRIC MODULE
摘要 <p>A manifold incorporating a thermoelectric module having a wide contact of a heat medium with a heat transfer surface of the thermoelectric module and an excellent heat exchange efficiency, and a circular thermoelectric module easily manufactured and constructed into a multi-stacked structure. The manifold (1) comprises a cooling-side manifold piece (2), a heating-side manifold piece (3), a cooling-side agitating member (5), a heating-side agitating member (6), a thermoelectric module (7) and a motor member (8). Heat transfer surfaces (50, 51) of the thermoelectric module (7) are disposed vertically, so that if air enters the cavities (52, 55), air rises along the heat transfer surfaces (50, 51) and exhausted from the exhaust ports (22, 43) at the top of the manifold (1). The cooling-side agitating member (5) and the heating-side agitating member (6) are provided with permanent magnets (33), so that the cooling-side agitating member (5) receives a driving force from the heating-side agitating member (6) and is rotated. A square thermoelectric module (11) is held between aluminum disks (12, 13) to form a circular thermoelectric module (10).</p>
申请公布号 WO1999018399(P1) 申请公布日期 1999.04.15
申请号 JP1998004496 申请日期 1998.10.05
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