| 摘要 |
<p>A resin paste comprises: (a) a maleimide having at least 2 maleimide groups; (b) liquid aliphatic primary diamine having a b.pt. greater than 100[deg]C, where the molar ratio of maleimide to diamine is 1-3 and the weight ratio of diamine to maleimide is 1.5-3; (c) upto 80 wt.% a filler; (d) upto 6 wt.% a thickener; (e) upto 1 wt.% a defoamer; (f) upto 5 wt.% a coupling agent; and (g) upto 10 wt.% a solid epoxy. Also claimed are: (I) a method of bonding two surfaces together comprising applying the resin paste to a surface, pressing the other surface against the resin paste and heating the resin paste to cure it; and (II) a method of bonding sealing an object comprising applying the resin paste to the object and heating. Pref. maleimide is a solid and is of formula (A), where R is aryl (aromatic) or 2-30C aliphatic; or formula (B), where n = 1 or more. Liquid diamine contains siloxane groups and is of formula H2N-R2-(-Si(R1)2-O-)m-Si(R1)2-R2-NH2 (C), where R1 = 1-4C alkyl or vinyl (methyl); R2 = 1-4C alkylene (n-propylene); and m = 7-200 (9-50). Liquid diamine is a mixture of 10-90 mole% siloxane-containing diamine and 10-90 mole% nonsiloxane-containing 20-40C diamine. Filler comprises silica, silver, alumina, and/or aluminium nitride.</p> |
