| 发明名称 |
A novel via hole profile and method fabrication |
| 摘要 |
A novel high performance and reliable interconnection structure for preventing via delamination. The interconnection structure of the present invention comprises a via connection which extends into and undercuts an underlying interconnection line to lock the via connection into the interconnection line. |
| 申请公布号 |
GB2308234(B) |
申请公布日期 |
1999.04.14 |
| 申请号 |
GB19970006661 |
申请日期 |
1995.07.14 |
| 申请人 |
* INTEL CORPORATION |
发明人 |
ALAN M * MYERS;PETER K * CHARVAT;THOMAS * LETSON;SHI-NING * YANG;PENG * BAI |
| 分类号 |
H01L21/3213;H01L21/768;H01L23/522;H01L23/532;(IPC1-7):H01L23/522 |
主分类号 |
H01L21/3213 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
