Nonwoven reinforcement for printed wiring base board and process for producing the same

摘要

There are disclosed a nonwoven reinforcement for a printed wiring base board which nonwoven reinforcement comprises a wet-system nonwoven fabric constituted of thermotropic cystalline polyester fiber having a melting point of 290 DEG C or higher( component A ) and a thermotropic cystalline polyester binder which has a melting point of 290 DEG C or higher and is in the form of a film having holes including at least 5 holes /mm<2> each with an area of opening of 400 to 10000 mu m<2> ( component B ), the component A being fixed by the component B; a process for producing the above nonwoven reinforcement; a printed wiring base board produced from the above nonwoven reinforcement; and a printed wiring board produced from the above printed wiring base board. The nonwoven reinforcement and the printed wiring ( base) board are excellent in various performances such as uniformity, dimensional stability, heat resistance and electrical characteristics such as dielectric constasnt and dielectric loss tangent.