Process for the deposition of thick coatings onto products in copper and alloys thereof

摘要

A process for the deposition of thick coatings with a thickness ≥ 1 mm on products made of copper or alloys thereof, wherein said products are subjected to the following operations: surface activation of the product made of copper or alloys thereof; optional heat stabilisation to a temperature below the ones causing deterioration of the chemical and physical properties of the copper or alloys thereof; deposition of a first layer, for example of Ni or alloys thereof; optional interdiffusion heat treatment; optional activation of the surface of the first layer; thermal stabilisation of said product at a temperature of between 20 DEG and 400 DEG C; deposition of one or more intermediate layers of at least one of the following: Al; AlSi; Cu; Ni; NiAl; NiCr; NiCu; MCrAlY (wherein M can be Ni, Co, Fe or mixtures thereof), mixtures thereof, or mixtures of said intermediate layers with said thick coating; thermal stabilisation of the product coated with said intermediate layers at a temperature of between 20 DEG and 300 DEG C; and deposition of said thick coating on the product coated with said intermediate layers. Figure 1 shows a photograph of the component obtained using the process as described in the present invention. <IMAGE>