| 发明名称 |
Formation of a bottle shaped trench |
| 摘要 |
<p>A method for forming a bottle shaped trench 20 in a semiconductor substrate 10 includes etching a trench having a tapered top portion 25 in the semiconductor device and continuing to etch with different etch parameters to impart a reentrant profile 22 to the trench. <IMAGE></p> |
| 申请公布号 |
EP0908936(A2) |
申请公布日期 |
1999.04.14 |
| 申请号 |
EP19980307809 |
申请日期 |
1998.09.25 |
| 申请人 |
SIEMENS AKTIENGESELLSCHAFT;INTERNATIONAL BUSINESS MACHINES |
发明人 |
MULLER, KARL P.;SCHMITZ, STEFAN;RANADE, RAJIV M. |
| 分类号 |
H01L21/302;H01L21/3065;H01L21/8242;H01L27/108;(IPC1-7):H01L21/306;H01L21/308 |
主分类号 |
H01L21/302 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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