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发明名称
CERAMIC PACKAGE
摘要
申请公布号
KR0176164(B1)
申请公布日期
1999.04.15
申请号
KR19950038997
申请日期
1995.10.31
申请人
SAMSUNG ELECTRONICS CO., LTD.
发明人
CHA, KI-HO;LEE, BYUNG-HUN;LEE, KYUNG-WUK
分类号
H01L21/78;(IPC1-7):H01L21/78
主分类号
H01L21/78
代理机构
代理人
主权项
地址
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