| 摘要 |
PROBLEM TO BE SOLVED: To enhance heat dissipation properties while suppressing concurrent switching noise by forming solder balls on an insulating film through through holes and connecting a conductor wiring connected with the power supply terminal and the ground terminal of a semiconductor element electrically with a metal plate through a conductive material. SOLUTION: A conductive layer, i.e., a copper foil, is bonded to an insulating film 2 and subjected to exposure and etching thus forming a conductor wiring 3. The conductor wiring 3 is connected with solder balls 9 through through holes 6 made through the conductor wiring 3. The conductor wiring 3 connected with the power supply terminal and the ground terminal of a semiconductor element 1 is then connected electrically with a metal plate 5 by applying a conductive material 7 of conductive resin produced by added a conductive filter, e.g. copper or silver particles, into an insulating resin. According to the structure, the metal plate 5 can serve as a heat dissipating unit and concurrent switching noise can be suppressed. |
