发明名称 HEAT-DISSIPATING STRUCTURE FOR CASE
摘要 <p>PROBLEM TO BE SOLVED: To enhance the heat-dissipating effect of a case causing no low- temperature burn of a human body when contacting the case. SOLUTION: At a bottom surface of a mold case 1, a thick hollow structure part 6 which comprises a cylindrical hollow with it is provided, and a plurality of through-slits 7 are provided at the hollow structure part 6. At a metal heat- dissipating plate 9 attached on an inner surface of the hollow structure part 6, a plurality of protruding parts 11, engaged with the slits 7 respectively, are provided, a tip end of the protruding part 11 is drawn in the slit 7 with a step from the surface of the mold case 1 formed, and no tip end of the protruding part 11 touches a human body, even if he touches the surface of the mold case 1. By connecting a high-temperature heat-generating body 2 to a metal heat- release plate 5 via a thermal interface material 3, the amount of heat generated by the high-temperature heat-generating body 2 is transported to the metal heat-dissipating plate 5, thus heat-dissipation is executed, while being diffused into a wide area owing to the high thermal conductivity of the metal heat- dissipating plate 5.</p>
申请公布号 JPH1197871(A) 申请公布日期 1999.04.09
申请号 JP19970250750 申请日期 1997.09.16
申请人 NEC GUMMA LTD 发明人 NOCHIDA KOHEI
分类号 G06F1/20;H05K7/20;(IPC1-7):H05K7/20 主分类号 G06F1/20
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