摘要 |
<p>PROBLEM TO BE SOLVED: To improve handling quality and to improve the positional accuracy in bonding of upper and lower substrates by cutting only the flexible substrate into a prescribed shape and peeling a member having flexibility from the flexible substrate in the state that the flexible substrate and the member having the flexibility are stuck to each other. SOLUTION: Transparent electrodes 4 are deposited in the state of sticking the flexible substrate 1 to a support film 2 and are subjected to patterning to arbitrary electrode shapes. The flexible substrate 1 is then fixed to a table adjusted in parallelism and a cutting blade molded to the same shape as the external shape of the panel is penetrated only through the flexible substrate 1, by which the substrate is cut to the external shape of the panel. At this time, the drop-in depth of the cutting blade is specified to the thickness of the flexible substrate 1+30μm so that the flexible substrate 1 is cut to the prescribed external shape in the position of a cutting part 10. The cut position is detected and the substrate is cut, by which the parting excellent in the positional accuracy is made possible. Consequently, the parting of the supporting film 2 together with the flexible substrate 1 does not arise and the fluidization in the same state as the state after the parting and before the parting of the flexible substrate 1 is made possible.</p> |