| 摘要 |
PROBLEM TO BE SOLVED: To improve the adhesion and biting characteristic of a semiconductor device lead frame to a seal resin as well as moisture resistance and air tightness by forming one or move V-shaped grooves into the entire outer side of a die pad for mounting a transistor chip. SOLUTION: A lead frame 1 has V-shaped grooves 5 at the entire outer side of a transistor mount 2 of its die pad 11 esp. at all the four faces of the die pad 11. The grooves provided at approximately the entire periphery of the die pad improve the adhesion and biting characteristics of the lead frame 1 to a seal resin over the entire periphery when resin sealing, resulting in the improvement of the moisture resistance and temp. cycle resistance characteristic. |
