| 摘要 |
PROBLEM TO BE SOLVED: To provide a lead frame which reduces output power level of the ultrasonic wave used for bonding the lead frame to a heat sink, and which prevents deformation and damage or the like of leads, and a method of manufacture thereof. SOLUTION: A lead frame comprises a lead frame body 2 and a heat sink plate 3, bonded together by using an ultrasonic-wave bonding method, wherein a metal layer having superior bonding property to the counter material in the ultrasonic bonding is formed on at least either of the both, and the bonding is performed via the metal layer. Manufacture of the lead frame contains a process of forming a layer of a metal having superior bonding property to the counter material in the ultrasonic bonding onto at least either of the lead frame body 2 and the heat sink plate 3, and a process of bonding the lead frame body 2 and the heat sink plate 3 via the metal layer by using an ultrasonic-wave bonding method. |
