发明名称 SEMICONDUCTOR DEVICE
摘要 PROBLEM TO BE SOLVED: To decide non-destructively, easily and correctly the quality of a corrosion state of a metal wiring under a via hole and contrive to facilitate and make efficient an inspection, by a method wherein inspection patterns of a plurality of holes of different opening diameters and intervals are provided. SOLUTION: A plurality of inspection areas shown by 1-1 to 1-n are provided, and in each of the inspection areas 1-1 to 1-n, a plurality of via holes 2 of different diameters and intervals are disposed. A diameter of the hole is 0.36 to 0.8μm, and a hole interval corresponds to hole density and is set in the range of 0.44 to 1.0μm, and in each of the inspection areas, a hole interval is made constant in each hole of a different diameter, but it increases as the inspection area is moved from 1-1 to 1-n. The inspection patterns of different diameters or densities are formed on a wafer whereby a corrosion state of a metal wiring under a hole 2 is observed using an optical microscope, and it can be decided in what degree the corrosion state of the metal wiring under a via hole has a surplus for variations of the diameter.
申请公布号 JPH1197499(A) 申请公布日期 1999.04.09
申请号 JP19970273968 申请日期 1997.09.19
申请人 NEC CORP 发明人 KAWABATA TAKAO
分类号 H01L21/66;(IPC1-7):H01L21/66 主分类号 H01L21/66
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