| 摘要 |
PROBLEM TO BE SOLVED: To improve wettability to mixed slurry containing C materials and taking mixed water of N-methyl-2-pyrrolidone and water or water as solvent by forming a plated layer made of a metal stable in relation to water and air and for not easily form a compound of them on a single surface or both surfaces of copper foil. SOLUTION: Ag, Au, Pd, Ni or the like can be given as a metal for forming a plated layer. The plated layer is formed by laminating a single metallic layer or many metallic layers, and it is desirable that the layer thickness is in the range of 0.2 to 2μm. When the silver plated layer is formed on the front surface of copper foil, mixed slurry containing C materials is brought in contact with the silver plated layer. Any organic contaminant is not stuck on the front surface of the silver plated layer formed by electrodeposition, and the formation of a natural oxide film can be ignored. Therefore, wettability of the silver plated layer and solvent made of mixed water of N-methyl-2-pyrrolidone and water or water and uniform coating performance of the mixed slurry in relation to the silver plated layer are improved.
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