| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor photosensor device which is capable of preventing deterioration of the characteristics and variation of optical characteristics through stable sealed state and capable of coping with under harsh conditions. SOLUTION: In a semiconductor photosensor device with a housing 1 constituted of an insulation material, a lead frame 2 extracted from an inside of the housing 1 to an outside, a semiconductor photosensor chip 6 fixed to a bottom part of the housing 1, a bonding wire 3 which electrically connects a terminal provided to the surface of the semiconductor photosensor chip 6 and a wiring member, a transparent silicon gel 4 which is filled in an inside of the housing 1 and covers an upper surface of the semiconductor photosensor chip 6 and a transparent plate 5 provided upward of the semiconductor photosensor chip 6 with the transparent silicon gel 4 between, holes 1a, 1b are provided to a bottom surface of the housing 1 and a surface of the transparent silicon gel 4 is exposed to the air from the holes 1a, 1b. |
