发明名称 PROCESSING DEVICE
摘要 PROBLEM TO BE SOLVED: To perform washing or drying of the chemical having the specified concentration by injecting the specified amount of the chemical into pure water or a dry-gas forming part, without the effect of the fluctuation of the flow rate or the pressure of the pure water and the carrier gas for the dry gas. SOLUTION: In this device, a main part is constituted of a washing tank 30 which stores cleaning solvent, immerses a semiconductor wafer W in the cleaning solvent and cleans the surface of the wafer, a cleaning-solvent supply pipe 33 which connects the cleaning tank 30 and a pure-water supply source 31, a chemical storing container 34 which stores the chemical, a chemical supply pipe 36 which connects the cleaning-solvent supply pipe 33 and the chemical storing container 34 through an injection opening and closing change valve 35, and a chemical supply means provided at the chemical supply pipe 36. At this time, the chemical supply means is formed of a reciprocating driving pump, e.g. a diaphragm pump 37.
申请公布号 JPH1197403(A) 申请公布日期 1999.04.09
申请号 JP19970269213 申请日期 1997.09.17
申请人 TOKYO ELECTRON LTD 发明人 KAMIKAWA YUJI;SHINDO NAOKI;KITAHARA SHIGENORI
分类号 H01L21/304;B08B3/10;F04B43/04;F04B43/073;H01L21/00;(IPC1-7):H01L21/304 主分类号 H01L21/304
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