| 摘要 |
<p>PROBLEM TO BE SOLVED: To enable connection between a pad and a lead even if a lead interval is made narrow, by raising a wire wherein a wire ball is formed by a specified length from a pad on a semiconductor chip, and joining a tip of the wire to a solder plating part of a lead rear. SOLUTION: In the semiconductor device, a wire 8 connects a pad on a semiconductor chip 1 to a lead 3 provided immediately thereon. The lead 3 is bonded to an upper surface of the semiconductor chip 1 through an adhesive tape 5, and an entire thereof is sealed by mold resin 7 in the state. Thereafter, a solder ball 4 is mounted on the lead 3. The solder plating 6 of the lead 3 is fused and is joined to a tip of the wire 8. A creeping up part of solder is formed and the lead 3 and a pad of the semiconductor chip 1 are connected. As a result, it is possible to arrange and join a lead immediately on a pad of a semiconductor chip, minimize the distance between a lead and a wire and miniaturize a semiconductor device.</p> |
