| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for aging chip-type capacitor by which the aging process of a chip type capacitor can be carried out quickly and the manufacturing cost of the capacitor can be reduced by rationalizing the mounting work of the capacitor and a device used for the method. SOLUTION: In a chip-type capacitor aging device 11, which is constituted to simultaneously perform heating and aging treatment on many chip type capacitors, while the capacitors are held by means of jigs 55 in a heating furnace 13 and discharge the treated capacitors from the furnace 13, the unprocessed capacitors randomly housed in a hopper 17 are sent to a downstream-side dam 24 faced to the jigs 55 while the capacitors are spread in the widthwise direction and arranged in order along the dam 24, when the capacitors come into contact with the dam 24. A vacuum finger device 14 collectively transfers the capacitor group to the jigs 55. |
