| 摘要 |
<p>A wafer cleaning apparatus (20) for polishing and cleaning semiconductor wafers (25) comprises a polishing station (30), and one or more cleaning stations (35), such as sonic cleaning stations (75), holding stations (80), rinsing stations (85), soaking stations (88), or drying stations (90). A robot transport system (40) (1) transports first wafers (25a) into the cleaning station for processing of the first wafers (25a) in the cleaning station; (2) transports second wafers (25b) into the cleaning station while the first wafers (25a) are still being processed in the station; (3) transports the first wafers (25a) out of the cleaning station after the first wafers (25a) have completed processing, and while the second wafers (25b) are still being processed; and (4) transports the second wafers (25b) out of the cleaning station after the second wafers (25b) have completed processing. The robot transport system (40) can transfer additional sets of wafers (25c) into the cleaning station, while the first and/or second wafers (25a, 25b) are being processed to further increase process throughput.</p> |
