| 摘要 |
<p>A method for metallizing microvias and high density interconnects in photodefined dielectrics using novel low temperature, fast curing metal-organic compounds. The materials are applied to the developed photoimage by any convenient printing process and thermally cured to well-consolidated pure metal conductors at the same time and under the same conditions that the dielectrics are cured and cross-linked to infusible, insoluble resins.</p> |
