Epoxy resin composition for encapsulation of semiconductor devices

摘要

An epoxy resin composition comprises a bisphenol epoxy resin, a phenol resin curing agent having a naphthalene structure, a curing accelerator consisting of an adduct of triphenyl phosphine and p-benzoquinone and 85-95 wt.% inorganic filler. An epoxy resin composition (I) for the encapsulation of semiconductor devices contains: (A) a bisphenol epoxy resin of formula (1); (B) a hardening agent of formula (2); (C) a hardening accelerator consisting of an addition product of triphenyl phosphine and p-benzoquinone; and (D) 85-95 wt.% inorganic filler. n = 0-6 ( in formula (1)); R1-R4 = H, 1-10 C alkyl; l, m = more than 0 n = more than 1 (in formula (2)); An Independent claim is included for a semiconductor device (II) consisting of a semiconductor element adhered to a substrate and encapsulated with the epoxy resin composition (I) on the side attached to the semiconductor element only.