发明名称 MICROELECTRONIC PACKAGES AND PACKAGING METHODS INCLUDING THERMALLY AND ELECTRICALLY CONDUCTIVE PAD
摘要 A method and a system for measuring the mechanical vibrations of an object. In order to simplify the electronic circuit necessary for the measurement chain and to reduce its costs, this method and this system are characterized in that they comprise the processing of an input signal, representative of an acceleration or of a velocity related to a mechanical vibration of said object, said input signal having a frequency spectrum comprising a so-called low frequency band, situated below a so-called transition frequency, and a so-called high frequency band, situated above said transition frequency, said method and system carrying out said processing of said input signal by means of an electronic circuit for producing an output signal which, in said low frequency band, corresponds to the mathematical integral over the time of said input signal, and, in said high frequency band, corresponds to said input signal.
申请公布号 CA2304528(A1) 申请公布日期 1999.04.08
申请号 CA19982304528 申请日期 1998.09.29
申请人 ERICSSON, INC. 发明人 FUGARO, ANTHONY SALVATORE
分类号 H05K1/02;H05K3/00;H05K3/42;H05K7/20;H05K9/00;(IPC1-7):H05K7/20 主分类号 H05K1/02
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