发明名称 |
SIMPLIFIED PROCESS AND APPARATUS FOR PRODUCTION OF COPPER FOIL |
摘要 |
A simplified process and apparatus for electrodepositing a bond-enhancing copper treatment layer on a surface of copper foil, preferably wherein a single treatment layer is uniformly applied on raw copper foil using a current density of from about 40 to about 100 A/ft<2>, a plating time of greater than 30 seconds, and the electrolyte is a copper sulfate-sulfuric acid solution containing arsenic, chloride ions and 2 imidazalidinethione. The raw foil is transferred directly from a rotating drum cathode machine on which it is produced, at the same speed at which the raw foil is produced, and then to a barrier layer station, a stainproofing station and a chemical adhesion promoter station, after which it is dried and coiled to a station for applying the treatment. |
申请公布号 |
WO9916935(A2) |
申请公布日期 |
1999.04.08 |
申请号 |
WO1998US20079 |
申请日期 |
1998.09.28 |
申请人 |
CIRCUIT FOIL USA, INC. |
发明人 |
YATES, CHARLES, B.;WOLSKI, ADAM;GASKILL, GEORGE;CHENG, CHINSAI, T.;BODENDORF, KEITH;DUFRESNE, PAUL |
分类号 |
C25D1/04;C25D3/38;C25D5/10;C25D5/16;C25D7/06;H05K3/00;H05K3/24;H05K3/38 |
主分类号 |
C25D1/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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