Encapsulating material for semiconductors

摘要

An encapsulating material for semiconductors with a conductor-on-chip structure contains an epoxy resin, a hardener, a hardening accelerator and an inorganic filler. In an encapsulating material for semiconductors with a conductor-on-chip structure containing an epoxy resin, a hardener, a hardening accelerator and an inorganic filler, the filler has a particle size 90% or less of the distance between the inner conductor and the semiconductor chip such that the distance is 70 microns or more, or 95% or less of the distance between the inner conductor and the semiconductor chip such that the distance is less than 70 microns. The amount of filler is 80-95%. An Independent claim is also included for a semiconductor comprising a chip (1), an inner conductor (2) secured to the chip using an adhesive strip (4), and an encapsulating material.