发明名称 |
METHOD FOR COATING A SILICON CHIP AND ELECTRONIC CARD COMPRISING AT LEAST ONE CHIP COATED BY SUCH METHOD |
摘要 |
The invention concerns the mechanical protection of a chip by means of a coating product poured on the chip and then allowed to set. The method consists in depositing only a fine layer of the coating product on the chip (P) and its wire connections (L1-L4), so as not to disrupt the functioning of the chip. In order to control said layer, the chip is mounted on a bump (T) whereof the height is selected such that the difference in height between the chip top (hp) and the top of the neighbouring printed circuits (hc) is equal to the thickness required for the coating. The coating product (R) is then poured onto the chip until it reaches, without exceeding it, the upper level of the printed circuits. The invention is particularly applicable to silicon chips operating in microwave frequencies. |
申请公布号 |
WO9917367(A1) |
申请公布日期 |
1999.04.08 |
申请号 |
WO1998FR02035 |
申请日期 |
1998.09.22 |
申请人 |
THOMSON-CSF;CACHIER, GERARD;DADEN, JEAN-YVES;GRANCHER, ALAIN;MICHEL, LUDOVIC |
发明人 |
CACHIER, GERARD;DADEN, JEAN-YVES;GRANCHER, ALAIN;MICHEL, LUDOVIC |
分类号 |
G06K19/077;H01L23/13;H01L23/31;H01L23/66 |
主分类号 |
G06K19/077 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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