| 摘要 |
A semiconductor laser diode bar assembly comprises a copper base plate (2) in which are mounted a plurality of heat pipes (3), for distributing heat within the base plate from a region under diode bar (4) mounted to the base plate. The assembly (1) is mounted on a heat sink (7) and electrically isolated from said heat sink by electrically insulating layer (7). Incorporation of the heat pipes into the base plate of the assembly, which base plate forms an electrode for the diode bar, results in more efficient cooling of the diode bar (4).
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