| 发明名称 |
Method for wire-bonding a covered wire |
| 摘要 |
To prevent melting and scattering of a covering-film during ball formation, the covering-film, at the time a ball is formed, has been completely removed from the portion of a covered wire which corresponds to the tail length that protrudes from the tip of a capillary.
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| 申请公布号 |
US5891796(A) |
申请公布日期 |
1999.04.06 |
| 申请号 |
US19960759228 |
申请日期 |
1996.12.05 |
| 申请人 |
KABUSHIKI KAISHA SHINKAWA |
发明人 |
NAKAMURA, OSAMU;SASAKURA, KAZUMASA |
| 分类号 |
B23K20/00;H01L21/60;(IPC1-7):H01L21/44 |
主分类号 |
B23K20/00 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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