ADHESIVE TAPE FOR ELECTRONIC COMPONENT

摘要

PROBLEM TO BE SOLVED: To provide an adhesive tape for an electronic component which possesses excellent heat resistance and adhesive properties by comprising: a polyimide comprising diphthalimidesulfone units and/or diphthalimideethylene glycol units and units of a product of a reaction of these compds. with a siloxane compd.; and a silane coupling agent. SOLUTION: This adhesive tape for an electronic component comprises an adhesive layer, the adhesive layer comprising: 100 pts.wt. polyimide comprising 100 to 30 mol.% structural units represented by formula I and/or formula II and 0 to 70 mol.% structural units represented by formula III and/or formula IV; and 0.1 to 15 pts.wt. silane coupling agent, such as an alkoxysilane. The structural units represented by formulae I to IV are obtd. by reacting diphenylsulfonetetracarboxylic acid dianhydride and ethylene glycol bistrimellitate dianhydrate with compds. represented by formulae V and VI. In the formulae, Ar represents a divalent group having an arom. ring selected from formula VII; R represents a 1-10C alkylene group or the like; Y represents an amino group or the like; and n is an integer of 1 to 20.