| 摘要 |
PROBLEM TO BE SOLVED: To provide an electrode plate holding structure, wherein the bonding processes of an electrode plate are reduced to make a reduction in the cost of the electrode plate possible, and when a dust cover is made to fit in the electrode plate, it does not come off from the plate. SOLUTION: An electrode plate 18 is positioned by a method, wherein a press-contact part 20 of the plate 18 is externally fixed in a projected part 8 for positioning use of a support plate 2. A circuit board 8 is positioned by a method, wherein the projected part 8 for positioning use of the plate 2 is inserted in a through hole 10 formed in the board 8. The part 20 of the plate 18 comes into contact with a contact point part 12 on the peripheral edge of this hole 10. When a cover 26 is mounted to the plate 2, the part 20 is compressed on a receiving part 28 and is brought into contact with the part 12 by pressure. |
