SEMICONDUCTOR MODULE

摘要

A method by which semiconductor chips or semiconductor packages (1) can be connected to a radiator (3) in a low-thermal-resistance and low-rigidity state at the time of collectively cooling a semiconductor module by the radiator. In the method, thin layers (8) of a flexible material having high thermal conductivity are put between the semiconductor chips or semiconductor packages (1) and the radiator (3) and replica solder layers (6 and 11) are respectively put between the semiconductor chips or semiconductor packages (1) and the radiator (3) and between a frame (4) and the radiator (3).