发明名称 Nozzle arrangement for repair equipment for semiconductor assembly
摘要 The arrangement has a hopper-shaped holder (31) connected to a repair device with a downward extending cylinder (33) with a rectangular lower end piece, a vacuum tube (35), a vacuum absorption body (37) and at least one tubular outlet bell (43) in contact with two side walls of the rectangular end piece
申请公布号 DE19802358(A1) 申请公布日期 1999.04.01
申请号 DE19981002358 申请日期 1998.01.22
申请人 LG SEMICON CO., LTD., CHEONGJU, KR 发明人 KIM, YOUNG-GON, CHEONGJU, KR
分类号 H05K13/00;B23K1/012;H05K13/04;(IPC1-7):H05K3/34 主分类号 H05K13/00
代理机构 代理人
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